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Neutron Sensor

Single Photon Analysis

STJ Formats

Thin Film Processing

Electro Processing

Process Equipment

Facilities

info@microfab.co.uk


Cambridge Microfab Ltd
Broadway, Bourn
Cambridge CB23 2TA
England

T: +44 (0) 1954 718100
F: +44 (0) 1954 718164

Thin Film Processing:

Materials Deposition

Materials Deposition

  • neutral stress films of:
  •   conductors
  •   semiconductors
  •   dielectrics
  • single crystal films
  • polycrystalline films
  • sputter systems with vacuum load locks
  • UHV conditions can be maintained for months
  • UHV systems are designed & built in-house
Temperature Control

Temperature Control

  • temperature control is important to facilitate phase & morphology control
  • our equipment has:
  • stable closed loop heating control
  • open loop Peltier refrigeration to -250C
  • liquid nitrogen refrigeration to -1700C
Chemical & Plasma Etching

Chemical & Plasma Etching

  • we routinely prepare & pattern a range of materials:
  • Al, Hf, Mo, Nb, Re, Ta, Ti, V, W
  • image left: part processed Ta-Al structure patterned by plasma & acid etching
  • pixel pitch nom 35 µm
  • wire width nom 2.5 µm